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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/1 tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 tsz22111 ? 14 ? 001 www.rohm.com serial-in / parallel-out driver series 4-input serial- in / parallel- out drivers bu2050f description bu2050f is a cmos output driver. it incorporates a built -in shift register and a latch circuit to turn on a maximum of 8 outputs by a 4-line interface, linked to a microcontroller. a cmos output provides maximum 25ma current. features ? led can be driven directly ? 8 bit parallel output applications ? drive of led ? drive of solenoid ? drive of relay pin configurations (top view) key specifications ? power supply voltage range: 4.5 v to 5.5v ? output voltage: 0v to v dd ? operating temperature range: - 40 c to +85c package w(typ) x d(typ) x h(max) sop14 8.70mm x 6.20mm x 1.71mm block diagrams sop14 bu2050f 13 12 11 10 9 8 7 6 5 4 3 2 data clk stb clr p2 p8 p7 p6 vss p5 p4 p1 1 vdd 14 p3 controller shift register 8bit latch write buffer p1 to p8 cl k data stb clr datashee t downloaded from: http:///
2/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 pin descriptions pin no. pin name io function 1 p3 o parallel data output 2 p4 3 p5 4 vss - ground 5 p6 o parallel data output 6 p7 7 p8 8 data i serial data input 9 clk i clock signal input 10 stb i strobe signal input in case of l, the data of shift register is outputted to p1 through p8 . in case of h, all parallel outputs and data of latch circuit do not change. 11 clr i reset signal input in case of l, the data of latch circuit reset, and all parallel outputs(p1 to p8) change into l . normally clr=h 12 p1 o parallel data output 13 p2 14 vdd - power supply absolute maximum ratings parameter sym bol limits unit supply voltage v dd -0.3 to +7.0 v input voltage v in v ss -0.3 to v dd +0.5 v output voltage v o v ss -0.3 to v dd +0.5 v operating temperature t opr -40 to +85 c storage temperature t stg -55 to +125 c power dissipation p d 0.45 (note 1) w (n ote 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 4.5m w per 1 c above 25 c . caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case th e ic is operated over the absolute maximum ratings. recommended operating conditions (t a =25 , v ss =0v) parameter symbol limits unit supply voltage v dd +4.5 to +5.5 v output voltage v o 0 to v dd v downloaded from: http:///
3/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics dc characteristics (unless otherwise specified, v dd =5v, v ss =0v, t a =25 ) parameter symbol limits unit condition min typ max input high-level voltage v ih 0.7v dd - v dd v - input low-level voltage v il v ss - 0.3v dd v - input hysteresis v hys - 0.5 - v - output high-level voltage v ohd v dd -1.5 - v dd v i oh =-25ma v dd -1.0 - v dd i oh =-15ma v dd -0.5 - v dd i oh =-10ma ou tput low-level voltage v old v ss - 1.5 v i ol =25ma v ss - 0.8 i ol =15ma v ss - 0.4 i ol =10ma quiescent current i dd - - 0.1 ma v ih =v dd , v il =v ss switching characteristics (unless otherwise specified , v dd =5v, v ss =0v, t a =25 ) parameter symbol limits unit condition min typ max set up time (data-clk) t sd 20 - - ns - hold time (data-clk) t hd 20 - - ns - set up time clk) stb ( ? t sstb 30 - - ns - hold time clk) stb ( ? t hstb 30 - - ns - propagation delay p8) p1 (clk to ? t pdpck - - 100 ns p1 to p8 terminal load 20pf or less propagation delay p8) p1 stb ( to ? t pdpstb - - 80 ns p1 to p8 terminal load 20pf or less propagation delay p8) p1 clr ( to ? t pdpclr - - 80 ns p1 to p8 terminal load 20pf or less maximum clock frequency f max 5 - - mhz - waveform of switching characteristics figure 1. waveform of switching characteristics t pdpck f max clk data p8 p1 stb clr 1 2 8 9 10 11 12 t hd t sd t hstb t sstb t pdpstb t pdpclr downloaded from: http:///
4/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 test circuits v dd v ss patterngenerator v ih v il v ss figure 2. test circuit of input h/lvoltage figure 3. test circuit of output h voltage v dd i oh v ohd 1 8 sw v ss v ss v ss patterngenerator figure 4. test circuit of output l voltage v dd i ol v old 1 8 sw v ss v ss v ss patterngenerator 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 3 4 5 6 7 8 9 10 11 12 13 14 downloaded from: http:///
5/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 test circuits - continued figure 6. test circuit of switching characteristics figure 5. test circuit of static dissipation current v dd v ss patterngenerator v ih v il v ss 1 2 3 4 5 6 7 8 9 10 11 12 13 14 v ss v dd a + i dd 1 2 3 4 5 6 7 8 9 10 11 12 13 14 downloaded from: http:///
6/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 timing chart figure 7 . timing chart 1. after the power is turned on and the voltage is stabilized, stb should be activated, after clocking 8 data bits into the data pin. 2. parallel outputs (p1 to p8) are set to the shift register data a fter the eighth clock by the stb. 3. since the stb is level latch, data is retained in the l section and renewed in the h section of the stb. function explanation ? a latch circuit has the reset function, which is common in all bits. in case of clr terminal is l , the latch circuit is reset non-synchronously without the other input condi tion, and all parallel outputs change into l . ? a serial data inputted from data terminal is read in shift regis ter with synchronized rising transition of clock. in case of stb is l (clr is h ), transmit the data which read in the shift register to latch circuit, and outputs from the parallel data output terminal (p1 to p8). in c ase of stb is h , all parallel outputs and the data of latch do not change. truth table i nput function clk stb clr l all the data of the latch circuit are set to l (data of shift register does not change), all the parallel outputs are l . h h serial data of data pin are latched to the shift register. at this time, the data of the latch circuit does not change. l l h the data of the shift register are transferred to the latch circ uit, and the data of the latch circuit are outputted from the parallel output pin. h the data of the shift register shifts 1bit, and the data of the latch circuit and parallel output also change. stb p1 to p8 previous data data clr l clk data data8 data7 data6 data2 data1 downloaded from: http:///
7/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuits p1 to p8 power dissipation power dissipation(total loss) indicates the power that can be consu med by ic at t a =25c(normal temperature). ic is heated when it consumed power, and the temperature of ic chip beco mes higher than ambient temperature. the temperature that can be accepted by ic chip depends on circuit configura tion, manufacturing process, and consumable power is limi ted. power dissipation is determined by the temperature allowed in ic chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). the max imum junction temperature is typically equal to the maxim um value in the storage temperature range. heat generated by con sumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this hea t dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja (c /w ).the temperature of ic inside the package can be estimated by this thermal resistance. figure 8 shows the model of therm al resistance of the package. thermal resistance ja , ambient temperature t a , maximum junction temperature t jmax , and power dissipation p d can be calculated by the equation below: ja = (t jmax - t a ) / p d (c /w ) derating curve in figure 9 indicates power that can be consume d by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambie nt temperature. this gradient is determined by thermal resistance ja . thermal resistance ja depends on chip size, power consumption, package, amb ient temperature, package condition, wind velocity, etc even when the same of pack age is used. thermal reduction curve indicates a referenc e value measured at a specified condition. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 25 50 75 100 125 ambient temperature [ ] power dissipation [w] 85 bu2050f(sop14) figure 9. derating curve figure 8. thermal resistance ?? ta [ ] ? ? tj [ ] M p [w] ambient temperature t a ( ) chip surface temperature t jmax ( ) power dissipation p d (w) ja =( t jmax - t a )/ p d (c /w ) data cl k stb clr vss vss v dd v dd vss vss vdd p1 to p8 data,clk,stb,clr downloaded from: http:///
8/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . th e electrical characteristics are guaranteed under the conditio ns of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may sub ject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
9/ 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitabl y formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutu al interference among circuits, operational faults, or physi cal damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoid ed. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even i f the power supply voltage is applied, make sure that th e input pins have voltages within the values specified in the e lectrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). ordering information b u 2 0 5 0 f - e 2 part number package f: sop14 packaging and forming specification e2: embossed tape and reel marking diagrams sop14(top view) b u 2 0 5 0 f lot number 1pin mark part number marking downloaded from: http:///
10 / 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information C continued package name sop14 (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) downloaded from: http:///
11 / 11 bu20 50 f tsz02201-0rhr1gz00120-1-2 ? 2013 rohm co., ltd. all rights reserved. 18.apr.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision chang es 08.nov.2013 001 new release 18 .sep.2015 002 page.6 truth table : when clr=l, modified the output=h-> l. 18 .apr.2016 003 page.1 features deleted this product can be operated on low voltage . page.1 key specifications modified power supply voltage range from 2.7v to 5.5v to 4.5v to 5.5v . page.2 pin descriptions modified function sentences of pin name stb and clr. page.2 recommended operating conditions modified supply voltage from +2.7v to +5.5v to +4.5v to +5.5v . page.3 electrical characteristics modified name from timing characteristics to switching characteristics page.3 electrical characteristics modified pin name of propagation delay t pdpck from clr to clk . page.6 timing chart modified pin name from stb to stb . modified description sentences. page.7 i/o equivalence circuits modified pin name from clock to clk . page.7 power dissipation modified description sentences. downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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